Hong Kong to Hold Tender for 1-Year RMB Government Bonds on July 24, 2025

The Hong Kong Monetary Authority (HKMA), acting on behalf of the Hong Kong Special Administrative Region Government (HKSAR Government), has announced a tender for 1-year RMB Institutional Government Bonds. The tender is scheduled for Thursday, July 24, 2025, as part of the Infrastructure Bond Programme, according to the Hong Kong Monetary Authority.

Tender Details

The tender will offer a total of RMB1.5 billion in bonds, which will mature on July 28, 2026. These bonds will provide an interest rate of 1.48% per annum, with interest being paid semi-annually. The tender is exclusively open to Primary Dealers appointed under the Infrastructure Bond Programme. Individuals interested in purchasing the bonds must apply through one of these Primary Dealers, with applications needing to be in amounts of RMB50,000 or integral multiples thereof.

Publication and Settlement

Results from the tender will be published on multiple platforms, including the HKMA’s website, the Hong Kong Government Bonds website, Bloomberg, and Refinitiv. The publication is expected no later than 3:00 pm on the day of the tender. Settlement of the tendered bonds is set for Monday, July 28, 2025.

Bond Characteristic and Use of Proceeds

The bonds, identified by the issue number 01GB2607001 and stock code 85038 (HKGB1.48 2607-R), will commence dealing on the Stock Exchange of Hong Kong on July 29, 2025. Proceeds from the bond issuance will be directed towards infrastructure projects, aligning with the Infrastructure Bond Framework outlined by the Hong Kong Government Bonds website.

Participation and Conditions

Each competitive tender must be submitted for an amount of RMB50,000 or its multiples through a Primary Dealer. Interested parties can refer to the Information Memorandum available on the Hong Kong Government Bonds website for additional details regarding the bonds and their issuance.

Image source: Shutterstock